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DATA SHEET
MOS INTEGRATED CIRCUIT
PD72012
HUB CONTROLLER FOR UNIVERSAL SERIAL BUS
The PD72012 is a dedicated LSI for a HUB connected to a universal serial bus (USB) system. It is an upgrade of NEC's PD72011. It complies with USB specification revision 1.1. By putting descriptors into ROM, information such as a user's vendor ID can be implemented in the chip.
FEATURES
Compliant with Chapter 11 (HUB Specifications) of USB Specification 1.1. Descriptors into ROM * The user can customize the vendor ID and product ID by using Mask ROM option. Supports 5 kinds of string descriptors (for Mask ROM code product only) On-chip sequencer * There is an on-chip descriptor and request response sequencer. External initial setup and control is not needed and HUB functions can be realized using only the PD72012. Downstream ports * Four or five ports can be selected using a pin function. Power modes * Bus power or self-power can be selected using a pin function (an external power control circuit is required). Corresponds to standard descriptor products * Two kinds of standard ROM code products are provided. Standard and HUB class descriptors are on-chip in the PD72012. ROM code: 003 (individual overcurrent monitoring type Generic HUB) ROM code: 004 (collective overcurrent monitoring type Generic HUB) Supports two kinds of clock input * 48 MHz oscillator input or a 4 MHz crystal resonator can be supported Power control * Port power control and overcurrent detection functions are on-chip. Individual port control or collective control can be selected for these.
ORDERING INFORMATION
Part No. Package 42-pin plastic SDIP (15.24 mm (600)) 44-pin plastic QFP (10 x 10)
PD72012CU-XXX PD72012GB-XXX-3B4
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. S13918EJ3V0DS00 (3rd edition) Date Published April 2001 NS CP(K) Printed in Japan
The mark
shows major revised points.
1999
2 Buffer/ Transceiver Endpoint0 Serial Interface Engine Endpoint1 Power Control Output PP1 PP2 PP3 PP4 PP5 HUB MODE Control Descriptor ROM (Standard/String) Over Current Detect CS1 CS2 CS3 CS4 CS5 Port Control 1 DPLL Port Control 2 Port Control 3 CLK 48 MHz Port Control 4 Port Control 5 Repeater Buffer/ Transceiver Buffer/ Transceiver Buffer/ Transceiver Buffer/ Transceiver Buffer/ Transceiver D10 D11 D20 D21 D30 D31 D40 D41 D50 D51 Repeater Common Control
UD0
UD1
PSSEL
PVSEL
Data Sheet S13918EJ3V0DS
DVDD AVDD1 AVDD2
CLKSEL OSL
X1 CLK /X2
DGND AGND1 AGND2 RST CLK : Connect to 48 MHz OSC Output X1, X2 : Connect to 4 MHz Xtal
PD72012
PD72012
PIN CONFIGURATION (Top View)
* 42-pin plastic SDIP (15.24 mm (600))
RST UD0 UD1 D10 D11 DGND D20 D21 D30 D31 DGND D40 D41 D50 D51 DGND OSL AVDD1 CLK/X2 X1 AGND1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 DGND PVSEL PSSEL DGND DVDD PP5 PP4 PP3 PP2 PP1 DVDD (Buffer) CLKSEL CS5 CS4 CS3 CS2 CS1 DGND (Buffer) DVDD AVDD2 AGND2
Data Sheet S13918EJ3V0DS
3
PD72012
* 44-pin plastic QFP (10x10)
DVDD (Buffer)
CLKSEL
DVDD
CS5
CS4 35
44 DVDD DGND PSSEL PVSEL DGND RST UD0 UD1 D10 D11 DGND 1 2 3 4 5 6 7 8 9 10 11 12
43
42
41
40
39
38
37
36
CS3 34 33 32 31 30 29 28 27 26 25 24 23 CS2 CS1 DGND (Buffer) DVDD AVDD2 AGND2 AGND1 X1 CLK/X2 AVDD1 OSL 22 DGND
PP5
PP4
PP3
PP2 15
13
14
PP1 16
17
18
19
20
21
D20
D21
D30
D31
D40
D41
D50
DGND
4
Data Sheet S13918EJ3V0DS
DGND
D51
PD72012
PIN NAME
AGND1 AGND2 AVDD1 AVDD2 CLKSEL CLK/X2 CS1 CS2 CS3 CS4 CS5 D10 D11 D20 D21 D30 D31 D40 : Analog GND1 (Xtal) : Analog GND2 (DPLL) : Analog VDD1 (Xtal) : Analog VDD2 (DPLL) : Clock Frequency Control : 48 MHz OSC, 4 MHz Xtal Clock Input : Over Current Detect #1 : Over Current Detect #2 : Over Current Detect #3 : Over Current Detect #4 : Over Current Detect #5 : Downstream Port #1 D+ : Downstream Port #1 D- : Downstream Port #2 D+ : Downstream Port #2 D- : Downstream Port #3 D+ : Downstream Port #3 D- : Downstream Port #4 D+ D41 D50 D51 DGND DGND (Buffer) DVDD DVDD (Buffer) OSL PP1 PP2 PP3 PP4 PP5 PSSEL PVSEL RST UD0 UD1 X1 : Downstream Port #4 D- : Downstream Port #5 D+ : Downstream Port #5 D- : Digital GND : Digital GND (Buffer) : Digital VDD : Digital VDD (Buffer) : OSC Suspend Output : Port Power Control #1 : Port Power Control #2 : Port Power Control #3 : Port Power Control #4 : Port Power Control #5 : Powered Mode Control : Down Port Value Control : Reset : Root Port #0 D+ : Root Port #0 D- : 4 MHz Xtal Clock Input
Data Sheet S13918EJ3V0DS
5
PD72012
CONTENTS
1. PIN FUNCTIONS ...................................................................................................................................................... 7 1.1 List of Pin Functions ......................................................................................................................................... 7 1.2 Tables by Pin Function ................................................................................................................................... 10 1.3 Equivalent Circuits of Pins.............................................................................................................................. 11 2. DESCRIPTORS ...................................................................................................................................................... 12 2.1 Standard Device Descriptor............................................................................................................................ 12 2.2 Standard Configuration Descriptor ................................................................................................................. 14 2.3 Standard Interface Descriptor......................................................................................................................... 16 2.4 Standard Endpoint Descriptor 1 ..................................................................................................................... 17 2.5 HUB Class Descriptor..................................................................................................................................... 17 2.6 Standard String Descriptor 0 .......................................................................................................................... 21 2.7 Standard String Descriptors 1 Through 5 ....................................................................................................... 21 3. ELECTRICAL SPECIFICATIONS .......................................................................................................................... 22 4. PACKAGE DRAWINGS ......................................................................................................................................... 32 5. RECOMMENDED SOLDERING CONDITIONS ..................................................................................................... 34
6
Data Sheet S13918EJ3V0DS
PD72012
1. PIN FUNCTIONS 1.1 List of Pin Functions
(1/3)
Pin No.Note 1(6) 2(7) Pin Name RST UD0 I/O I I/O Signal Name RESET Data0 Inputs reset signals. Connects to upstream port #0 D+ signal line. Pull up to 3.3 V line using 1.5 k. Connects to upstream port #0 D- signal line. Connects to downstream port #1 D+ signal line. Pull down to GND using 15 k. Connects to downstream port #1 D- signal line. Pull down to GND using 15 k. Connect to GND. Connects to downstream port #2 D+ signal line. Pull down to GND using 15 k. Connects to downstream port #2 D- signal line. Pull down to GND using 15 k. Connects to downstream port #3 D+ signal line. Pull down to GND using 15 k. Connects to downstream port #3 D- signal line. Pull down to GND using 15 k. Connect to GND. This pin is used as both pins 16 and 17 internally in the QFP product. Connects to downstream port #4 D+ signal line. Pull down to GND using 15 k. Connects to downstream port #4 D- signal line. Pull down to GND using 15 k. Connects to downstream port #5 D+ signal line. Pull down to GND using 15 k. Connects to downstream port #5 D- signal line. Pull down to GND using 15 k. Test pin of PD72012 (corresponds to TS3 pin in PD72011). Connect to GND. Pin that outputs high level on suspend. Can be used by LED switch or to turn oscillator ON/OFF on suspend. Function
3(8) 4(9)
UD1 D10
I/O I/O
Data1 Data0
5(10)
D11
I/O
Data1
6(11) 7(12)
DGND D20
I/O
DGND Data0
8(13)
D21
I/O
Data1
9(14)
D30
I/O
Data0
10(15)
D31
I/O
Data1
11(16, 17) 12(18)
DGND
-
DGND
D40
I/O
Data0
13(19)
D41
I/O
Data1
14(20)
D50
I/O
Data0
15(21)
D51
I/O
Data1
16(22)
DGND
-
DGND (TS3)
17(23)
OSL
O
OSC CTL
CAUTION For self-power, always input an oscillator output signal. If the clock is cut-off, subsequent operation my not be possible.
Note QFP pin numbers are shown in ( ).
Data Sheet S13918EJ3V0DS
7
PD72012
(2/3)
Pin No.Note 1 18(24) Pin Name AVDD1 I/O Signal Name AVDD1 Function Power supply pin of on-chip clock drive circuit. To stabilize the power supply, connect directly to a stable power supply using the shortest wire possible or connect to GND via a capacitor along the wire (3.3 V input). When you input a clock signal from an oscillator, input at the 48 MHz CMOS level (5 V can be input). When using a 4 MHz crystal oscillator, connect the oscillator to this pin. When using a 4 MHz crystal oscillator, connect the oscillator to this pin. GND pin of on-chip clock drive circuit. Connect to GND. GND pin of on-chip frequency multiplier (PLL). Connect to GND. Power supply pin of on-chip frequency multiplier (PLL). To stabilize the power supply, connect directly to a stable power supply using the shortest wire possible or connect to GND via a capacitor along the wire (3.3 V input). Test pin of PD72012 (corresponds to TS1 pin in PD72011). Connect to 3.3 V power supply. Connect to GND.
19(25)
CLK / X2
I
CLOCK / XTAL
20(26)
X1
I
XTAL
21(27)
AGND1
-
AGND1
22(28)
AGND2
-
AGND2
23(29)
AVDD2
-
AVDD2
24(30)
DVDD
-
DVDD (TS1) DGND (Buffer) PORTCURRENT1
25(31)
DGND (Buffer) CS1
-
26(32)
I
Low active input pin that inputs overcurrent states detected by external circuit of downstream port #1. When not using this pin, connect it directly to VDD. Note 2 Low active input pin that inputs overcurrent states detected by external circuit of downstream port #2. When not using this pin, connect it directly to VDD. Note 2 Low active input pin that inputs overcurrent states detected by external circuit of downstream port #3. When not using this pin, connect it directly to VDD. Note 2 Low active input pin that inputs overcurrent states detected by external circuit of downstream port #4. When not using this pin, connect it directly to VDD. Note 2 Low active input pin that inputs overcurrent states detected by external circuit of downstream port #5. When not using this pin, connect it directly to VDD. Note 2
27(33)
CS2
I
PORTCURRENT2
28(34)
CS3
I
PORTCURRENT3
29(35)
CS4
I
PORTCURRENT4
30(36)
CS5
I
PORTCURRENT5
Notes 1. 2.
Pin numbers for QFP are shown in ( ). For details, refer to Table 1-3 in 1.2 Tables by Pin Function.
8
Data Sheet S13918EJ3V0DS
PD72012
(3/3)
Pin No.Note 1 31(37) Pin Name CLKSEL I/O I Signal Name CLK SELECT Function Pin for selecting whether to use 48 MHz oscillator or 4 MHz crystal oscillator (refer to Table 1-1). Connect to 3.3 V power supply.
32(38)
DVDD (Buffer) DVDD
-
DVDD (Buffer) DVDD
(39)
-
Connect to 3.3 V power supply. This pin is used together with pin No. 32 internally in the shrink DIP product. Low active open drain output pin that controls downstream port #1 power supply. Input the output of this pin to the power control element of an external circuit. If not using this pin, leave it unconnected. Note 2 Low active open drain output pin that controls downstream port #2 power supply. Input the output of this pin to the power control element of an external circuit. If not using this pin, leave it unconnected. Note 2 Low active open drain output pin that controls downstream port #3 power supply. Input the output of this pin to the power control element of an external circuit. If not using this pin, leave it unconnected. Note 2 Low active open drain output pin that controls downstream port #4 power supply. Input the output of this pin to the power control element of an external circuit. If not using this pin, leave it unconnected. Note 2 Low active open drain output pin that controls downstream port #5 power supply. Input the output of this pin to the power control element of an external circuit. If not using this pin, leave it unconnected. Note 2 Test pin of PD72012 (corresponds to TS0 pin in PD72011). Connect to 3.3 V power supply. Connect to GND. Pin that selects switching between bus power and self-power (refer to Table 1-2). To make high level, pull up to 3.3 V. Pin that selects switching between number (4 or 5) of downstream ports (refer to Table 1-2). To make high level, pull up to 3.3 V. Test pin of PD72012 (corresponds to TS2 pin in PD72011). Connect to GND.
33(40)
PP1
O
PORTPOWER#1
34(41)
PP2
O
PORTPOWER#2
35(42)
PP3
O
PORTPOWER#3
36(43)
PP4
O
PORTPOWER#4
37(44)
PP5
O
PORTPOWER#5
38(1)
DVDD
-
DVDD (TS0) DGND Power SW
39(2) 40(3)
DGND PSSEL
I
41(4)
PVSEL
I
Port Value
42(5)
DGND
-
DGND (TS2)
Notes 1. 2.
QFP pin numbers are shown in ( ). For details, refer to Table 1-4 of 1.2 Tables by Pin Function.
Data Sheet S13918EJ3V0DS
9
PD72012
1.2 Tables by Pin Function
Table 1-1. Oscillator Circuit Switching Control (CLKSEL)
CLKSEL L H Type of oscillator circuit Input clocks from 48 MHz oscillator Clock input using 4 MHz crystal resonator (drive circuit is incorporated)
Remark
Directly connect to VDD when using CLKSEL="H". Even 5 V is no trouble. Table 1-2. Power Mode/Downstream Port Number Control (PSSEL, PVSEL)
PSSEL L L H H
PVSEL L H L H
Power mode Self-power Note 1 Self-power Note 1 Bus power Note 2 Prohibited
Note 3
Port #1
Port #2
Port #3
Port #4
Port #5 x
x - - - - -
Notes 1. 2. 3. Remark
Do not cut-off clock input when using self-power. If it is cut-off, internal functions stop and operation may not be possible even if clocks are input again. When using bus power, up to four ports can be used. The combination PSSEL="H", PVSEL="H" is prohibited. Operation in this case is not guaranteed. Also set according to this table when setting the number of ports in a Mask ROM code product to up to 5 ports. Directly connect data lines of unused ports to GND.
Table 1-3. Handling of Pins CS1 to CS5 According to Setting of wHubCharacteristics Field of HUB Class Descriptor
wHubCharacteristics Bits 4, 3 0b00 0b01 0b10 or 0b11 Port #1 Not available Port #2 Not available CS1 CS2 CS3 CS4 CS5
Common in all ports Port #3 Not available Port #4 Not available Port #5 Not available
Remark
Connect pins CS1 to CS5 to the Over Current Detect output pin of the power switch IC. Clamp an unused or unavailable CS1 to CS5 pin to 3.3 V.
Table 1-4. Handling of Pins PP1 to PP5 According to Setting of wHubCharacteristics Field of HUB Class Descriptor
wHubCharacteristics Bits 1, 0 0b00 0b01 Port #1 Port #2 PP1 PP2 PP3 PP4 PP5
Common in all ports Port #3 Port #4 Port #5
Remark
Connect pins PP1 to PP5 to the Port Power Control input pin of the power switch IC. Leave an unused or unavailable PP1 to PP5 pin open.
10
Data Sheet S13918EJ3V0DS
PD72012
1.3 Equivalent Circuits of Pins
Type 5 V tolerant input pin (Schmitt) Equivalent Circuit Pins RST, CS1 to CS5 Function 3.3 V Schmitt input pin with 5 V tolerant.
5 V Schmitt on-chip
5 V tolerant input pin CLKSEL, PSSEL, PVSEL 3.3 V input pin with 5 V tolerant.
5V 5 V tolerant clock input pin X1, CLK/X2 3.3 V dedicated clock input pin with 5 V tolerant.
5V 5 V tolerant 3.3 V output pin OSL 3.3 V output pin with 5 V tolerant. Pull-up to 5 V line is possible.
3.3 V, IOL=6 mA
Open-drain output pin PP1 to PP5 Open-drain structure pin.
USB buffer IN/OUT(D+) (D-) RxSE0 TxDATA RxDATA
UD0, UD1, D10 to D50, D11 to D51
USB buffer. The two kinds of receiver are DATA receiver and SE0 (single end 0) receiver on the receiving side. On the sending side, rise and fall times are managed in the last stage of the buffer in order to create a difference between low-speed and full-speed.
Data Sheet S13918EJ3V0DS
11
PD72012
2. DESCRIPTORS
Caution For a Mask ROM code product, we release the software to make a data for Mask ROM option. Please contact to Local NEC to get the software if you would like to make Mask ROM code product.
2.1 Standard Device Descriptor
(1/2)
No. Field Size (Bytes) Contents Value Standard ROM code product 003 0 bLength 1 Shows the size in bytes of the standard device descriptor. Shows that this is a standard device descriptor. Shows that the PD72012 compliant with USB Specifications Revision 1.1. 4 bDeviceClass 1 HUB class code defined by USB (HUB_CLASSCODE="0x09"). HUB subclass code defined by USB. Not defined in HUB class. Protocol code defined by USB. Not defined in HUB class. Shows the maximum packet size in bytes of endpoint 0 of the PD72012. Shows the vendor ID code registered in USB standards. For a standard ROM code product (003, 004), this is "0x0409" (NEC vendor ID). When using in a Mask ROM code product, set a vendor ID for each manufacturer registered in USB standards. Shows the product ID code registered in USB standards. For a standard ROM code product (003, 004), this is "0x55AB" (Generic_HUB). In a Mask ROM code product, this value can be set as you wish. Shows the version number of the PD72012 using decimal notation in XX.XX format. For a standard ROM code product (003, 004), this is "0x0200" (Ver. 2.0). When using in a Mask ROM code product, manage by varying the number for each ROM code. 0x09 0x09 0x09 0x12 004 0x12 Mask ROM code product 0x12
1 2
bDescriptorType bcdUSB
1 2
0x01 0x0110
0x01 0x0110
0x01 0x0110
5
bDeviceSubClass
1
0x00
0x00
0x00
6
bDeviceProtocol
1
0x00
0x00
0x00
7
bMaxPacketSize0
1
0x08
0x08
0x08
8
idVendor
2
0x0409
0x0409
0xXXXX
10
IdProduct
2
0x55AB
0x55AB
0xXXXX
12
bcdDevice
2
0x0200
0x0200
0xXXXX
12
Data Sheet S13918EJ3V0DS
PD72012
(2/2)
No. Field Size (Bytes) Contents Value Standard ROM code product 003 14 iManufacture 1 Shows the index of the string descriptor for a comment about a manufacturer using the HUB. Since not used for a standard ROM code product (003, 004), its value is "0x00". When using this for a Mask ROM code product, set it to "0x01". Shows the index of the string descriptor for a comment about a product using the HUB. Since not used for a standard ROM code product (003, 004), its value is "0x00". When using this for a Mask ROM code product, set it to "0x02". Shows the index of the string descriptor for the serial number of a product using the HUB. Since not used for a standard ROM code product (003, 004), its value is "0x00". When using this for a Mask ROM code product, set it to "0x03". Shows the number of configurations that can be set for this HUB. Its value is fixed at "0x01" for the PD72012 0x00 004 0x00 Mask ROM code product 0x00 or 0x01
15
iProduct
1
0x00
0x00
0x00 or 0x02
16
iSerialNumber
1
0x00
0x00
0x00 or 0x03
17
bNumConfiguration
1
0x01
0x01
0x01
Data Sheet S13918EJ3V0DS
13
PD72012
2.2 Standard Configuration Descriptor
(1/2)
No. Field Size (Bytes) Contents Value Standard ROM code product 003 0 bLength 1 Shows the size in bytes of the standard configuration descriptor. Shows that this is a standard configuration descriptor. Shows the total length of descriptors returned on a host Get_Descriptor (Configuration) request (standard configuration, standard interface, each standard endpoint, and HUB class descriptors). Shows the number of interfaces that can be set in this configuration. Its value is fixed at "0x01" for the PD72012. Specifying this value in a Set_Configuration request from the host sets this configuration in the PD72012. Shows the index of the string descriptor for a comment about the configuration of a product using the HUB. Since not used for a standard ROM code product (003, 004), its value is "0x00". When using this for a Mask ROM code product, set it to "0x04". Uses a bitmap to show the power supply attributes of this configuration of the PD72012. Caution Since the information "Self-power" in the status returned on a Get_Status request from the host reflects the level input to the PSSEL pin, be sure that there are no inconsistencies. "0xE0": Corresponds to both "bus power" and "selfpower" modes and shows that "Remote Wakeup" is supported. A standard ROM code product has this setting. Use this setting when using in "self-power" mode only or when switching between "bus power" and "self-power" by performing a PSSEL pin function. "0xA0": Corresponds to "bus power" mode only and shows that "Remote Wakeup" is supported. Make this setting when using in "bus power" mode only. 0x09 004 0x09 Mask ROM code product 0x09
1
bDescriptorType
1
0x02
0x02
0x02
2
wTotalLength
2
0x0019
0x0019
0x0019
4
bNumInteface
1
0x01
0x01
0x01
5
bConfigurationValue
1
0x01
0x01
0x01
6
iConfiguration
1
0x00
0x00
0x00 or 0x04
7
bmAttributes
1
0xE0
0xE0
0xE0 or 0xA0
14
Data Sheet S13918EJ3V0DS
PD72012
(2/2)
No. Field Size (Bytes) Contents Value Standard ROM code product 003 8 MaxPower 1 Shows the maximum current the HUB consumes in normal operation in hexadecimal notation using units of 2 mA. Since it provides 1 UnitLoad (= 100 mA) to each port downstream, this is not included in MaxPower. However, if a non-removable device is connected downstream, this is included (for details inquire in the USB-IF). Switching the input level of the PSSEL pin changes the value that is returned. In short, two-way setting of the PD72012 is possible for "self-power" and "bus power". Mask ROM code product For a "bus power" setting (PSSEL="H"), normally set this to 0x32 (100 mA). However, when making a subordinate port a non-removable port, add the current consumed by the device connected to that port when you set the MaxPower value. On the other hand, For a "self-power" setting (PSSEL="L"), 0x32 (100 mA) is fixed. 004 Mask ROM code product
0x32 0x32 0x32 (PSSEL="L") (PSSEL="L") (PSSEL="L") or or or 0x32 0x32 0x32 (PSSEL="H") (PSSEL="H") (PSSEL="H") (recommended value)
Data Sheet S13918EJ3V0DS
15
PD72012
2.3 Standard Interface Descriptor
No. Field Size (Bytes) Contents Value Standard ROM code product 003 0 bLength 1 Shows the size in bytes of the standard interface descriptor. Shows that this is a standard interface descriptor. If there are multiple interfaces, the host specifying this value in a Set_Interface request selects this interface. This is "0x00" for the PD72012. This value is used if there is an alternate setting of the interface. It is "0x00" for the PD72012. Shows the number of endpoints defined in this interface. HUB class code defined by USB (HUB_CLASSCODE="0x09"). HUB subclass code defined by USB. Protocol code defined by USB. Not defined in HUB class. Shows the index of the string descriptor for a comment about the interface of a product using the HUB. Since not used for a standard ROM code product (003, 004), its value is "0x00". When using this for a Mask ROM code product, set it to "0x05". 0x09 004 0x09 Mask ROM code product 0x09
1 2
bDescriptorType bInterfaceNumber
1 1
0x04 0x00
0x04 0x00
0x04 0x00
3
bAlternateSetting
1
0x00
0x00
0x00
4
bNumEndpoints
1
0x01
0x01
0x01
5
bIntefaceClass
1
0x09
0x09
0x09
6 7
bInterfaceSubClass bInterfaceProtocol
1 1
0x00 0x00
0x00 0x00
0x00 0x00
8
iInteface
1
0x00
0x00
0x00 or 0x05
16
Data Sheet S13918EJ3V0DS
PD72012
2.4 Standard Endpoint Descriptor 1
No. Field Size (Bytes) Contents Value Standard ROM code product 003 0 bLength 1 Shows the size in bytes of standard endpoint descriptor 1. Shows that this is a standard endpoint descriptor. Shows the EndpointAddress of endpoint 1. Shows the attributes of endpoint 1 (Interrupt="0x03"). Shows the maximum packet size of endpoint 1. For an Interrupt attribute endpoint, shows the polling time in milliseconds using hexadecimal notation. For a HUB, the maximum value that can be set ("0xFF") is entered. 0x07 004 0x07 Mask ROM code product 0x07
1 2 3
bDescriptorType bEndpointAddress bmAttributes
1 1 1
0x05 0x81 0x03
0x05 0x81 0x03
0x05 0x81 0x03
4 6
wMaxPacketSize bInterval
2 1
0x0001 0xFF
0x0001 0xFF
0x0001 0xFF
2.5 HUB Class Descriptor
(1/4)
No. Field Size (Bytes) Contents Value Standard ROM code product 003 0 1 2 bDescLength bDescriptorType bNbrPort 1 1 1 Shows the size in bytes of the HUB class descriptor. Shows that this is a HUB class descriptor. 0x09 0x29 004 0x09 0x29 Mask ROM code product 0x09 0x29
0xXX 0x04 Shows the number of downstream ports the HUB 0x04 supports in a set. (PVSEL="L") (PVSEL="L") (PVSEL="L") or For a standard ROM code product (003, 004), the or or 0x05 value varies according to the PVSEL pin setting. 0x05 0xYY It is "0x05" for a 5-port HUB (PVSEL="H"), and (PVSEL="H") (PVSEL="H") (PVSEL="H") "0x04" for a 4-port HUB (PVSEL="L"). For a Mask ROM code product, the value in this field can be set arbitrarily. Since two-way setting by switching the PVSEL input level is possible for these values, perform two-way specification. Note that the values that are set for PVSEL="H" are from "0x01" to "0x05", and the values that are set for PVSEL="L" are from "0x01" to "0x04". The PD72012 enables ports in turn starting from the smallest port number.
Data Sheet S13918EJ3V0DS
17
PD72012
(2/4)
No. Field Size (Bytes) Contents Value Standard ROM code product 003 3 wHubCharacteristics 2 Uses a bitmap to show attributes of the PD72012. The meaning of each bit is as follows. Bits 1,0: Show the power switch switching attribute. "0b00": Enable all power switches at once. This is the value for a standard ROM code product (004). If this value is set for a Mask ROM code product, all of pins PP1 to PP5 operate at once. "0b01": Enable power switches individually for each port. This is the value for a standard ROM code product (003). If this value is set for a Mask ROM code product, pins PP1 to PP5 operate individually. "0b1X": Reserved. Used only on 1.0 compliant hubs that implement no power switching. You can not use this setting for PD72012. Bit 2: Identifier of a compound device. Set this to "0b0" when using the PD72012 as a 0x0009 004 0x0000 Mask ROM code product 0x00XX
unit HUB and to "0b1" when using it as compound devices. "0b0": Shows that the PD72012 is standalone HUB unit. "0b1": Shows that PD72012 is a part of compound devices. Bits 4,3: Show the overcurrent protection switching attribute. "0b00": Monitor overcurrent for all ports in a batch. Since this is the value for a standard ROM code product (004), a circuit that can control all overcurrent protection functions at once externally is needed. If this value is set for a Mask ROM code product, when one of the pins CS1 to CS5 detect overcurrent, Hub reports overcurrent on per- hub basis.
18
Data Sheet S13918EJ3V0DS
PD72012
(3/4)
No. Field Size (Bytes) Contents Value Standard ROM code product 003 3 wHubCharacteristics 2 "0b01": Monitor overcurrent for each port individually. Since this is the setting for a standard ROM code product (003), a circuit that can individually control overcurrent protection functions externally is needed. If this value is set for a Mask ROM code when one of the pins CS1 to CS5 detect overcurrent, Hub reports overcurrent on per- port basis. "0b1X": Shows that there is no overcurrent protection function. This setting is allowed only for bus-powered hubs that do not implement over-current protection. If this value is set for a Mask ROM code product, clamp all of the pins CS1 to CS5 to 3.3 V. Bits 15-5: These bits are reserved in the USB standard for future extended functions. For a Mask ROM code product, be sure to set these bits to "0". Caution Be sure to set the values in bits 3 and 0 the same in Mask ROM code product settings. 5 bPowerOn2PwrGood 1 Shows the time from detecting a device at a port and starting the power-on sequence until the power supply stabilizes. Two milliseconds are taken as one unit. This is 100 ms for the PD72012. Shows the maximum current consumption of the HUB in mA. Note that this value does not show the rated current consumption value for the PD72012 itself. For a standard ROM code product, "0x50" is applied for compatibility with the PD72011. This value can be defined for a Mask ROM code product. However, this value should not be less than the current consumption value of the PD72012 that is described in 3. ELECTRICAL SPECIFICATIONS. 0x32 0x32 0x32 0x0009 004 0x0000 Mask ROM code product 0x00XX
6
bHubContrCurrent
1
0x50
0x50
0xXX
Data Sheet S13918EJ3V0DS
19
PD72012
(4/4)
No. Field Size (Bytes) Contents Value Standard ROM code product 003 7 bDeviceRemovable 1 Uses a bitmap to show whether or not removable devices are connected to HUB ports. "1" shows that the connected device is nonremovable, and "0" shows that it is removable. Set "1" if a port that is used cannot be connected nor disconnected using an external circuit. Note that, if a non-removable device is connected to a downstream port of the HUB, bit 2 of wHubCharacteristics field should be set to "1". When the number of ports that can be port enabled is limited by the PVSEL pin setting or Mask ROM code product settings, set "0" for all ports that are not port enabled. The meaning of the bitmap is as follows. Bit 0: Bit 1: Always set to "0". If "1", the device connected to port 1 is non-removable. Bit 2: If "1", the device connected to port 2 is non-removable. Bit 3: If "1", the device connected to port 3 is non-removable. Bit 4: If "1", the device connected to port 4 is non-removable. Bit 5: If "1", the device connected to port 5 is non-removable. Bits 7,6: Always set to "0". For a standard ROM code product (003, 004), all ports are removable. 8 bPortPwrCtrlMask 1 This field exists for reasons of compatibility with software written for 1.0 compliant devices. All bits in this field should be set to 1B. 0xFF 0xFF 0xFF 0x00 004 0x00 Mask ROM code product 0xXX
20
Data Sheet S13918EJ3V0DS
PD72012
2.6 Standard String Descriptor 0
Standard string descriptor 0 cannot be used in a standard ROM code product.
No. Field Size (Bytes) Contents Value Standard ROM code product 003 0 1 2 bLength bDescriptorType wLANGID[0] 1 1 2 Shows the size of standard string descriptor 0. Shows that this is a standard string descriptor. Shows the LanguageID of standard string descriptor 0. The LanguageID used is "0x0409" (Generic). The PD72012 uses this LanguageID in common for all string descriptors. 0x00 0x00 0x0000 004 0x00 0x00 0x0000 Mask ROM code product 0x04 0x03 0x0409
2.7 Standard String Descriptors 1 Through 5
Standard string descriptors 1 through 5 cannot be used in a standard ROM code product. This format is the common format for standard string descriptors #1 through #5 of the PD72012.
No. Field Size (Bytes) Contents Value Standard ROM code product 003 0 bLength 1 Shows the size of standard string descriptors 1 through 5. Its value is fixed at 66 bytes (0x42). The string itself is this size -2 (64 bytes). Shows that this is a standard string descriptor. Stores the standard string descriptor in UNICODE. A string requires 2 bytes for each character. Strings of up to 32 characters can be specified. If there are white space characters, pad using NULL characters (0x0000). 0x00 004 0x00 Mask ROM code product 0x42
1 2
bDescriptorType bString
1 64
0x00 All 0
0x00 All 0
0x03 -
Remark
Five kinds of standard string descriptors can be defined and these describe the following contents using 32 UNICODE characters.
Index 1 2 3 4 5 Contents Comment about manufacturer (Manufacture) that uses HUB Comment about product (Product) that uses HUB Serial number (SerialNumber) of product that uses HUB Comment about configuration (Configuration) of product that uses HUB Comment about interface (Interface) of product that uses HUB
Refer to "The Unicode Standard, Worldwide Character Encoding, Version 1.0, Volume 1 and 2", The Unicode Consortium, Addison-Wesley Publishing Company, Reading, Massachusetts regarding UNICODE.
Data Sheet S13918EJ3V0DS
21
PD72012
3. ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
Parameter Power supply voltage Input voltage Symbol VDD VI USB buffer UD0, UD1, D10 to D50, D11 to D51 Clock input buffer X1, CLK/X2 5 V Schmitt input buffer RST, CS1 to CS5 5 V input buffer CLKSEL, PSSEL, PVSEL Output voltage VO USB buffer UD0, UD1, D10 to D50, D11 to D51 Open drain output buffer PP1 to PP5 5 V output buffer OSL Output current Operating ambient temperature Storage temperature IO TA Tstg Conditions Rating -0.5 to +4.6 -0.5 to +4.6 Unit V V
-0.5 to +6.6
V
-0.5 to +6.6
V
-0.5 to +4.6
V
-0.5 to +4.6
V
-0.5 to +6.6
V
-0.5 to +6.6
V
100 0 to +70 -65 to +150
mA C C
Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. Recommended Operating Conditions (TA = 0 to +70C)
Parameter Power supply voltage High level input voltage Low level input voltage High level input voltage Low level input voltage Input rise time for RST High level input voltage Low level input voltage High level input voltage Low level input voltage Clock input frequency Symbol VDD VIH VIL VIH VIL tr VIH VIL VIH VIL fCK USB pin UD0, UD1, D10 to D50, D11 to D51 5 V Schmitt input pin RST, CS1 to CS5 0.3 V to 2.7 V 5 V input pin CLKSEL, PSSEL, PVSEL Clock input pin (at 48 MHz input) X1, CLK/X2 Oscillator input (+100 ppm) Oscillator input (+50 ppm) 2.0 0 2.3 0 48.00 4.0 Conditions MIN. 3.0 2.0 0 2.3 0 TYP. 3.3 MAX. 3.6 VDD 0.8 5.5 0.8 10 5.5 0.8 5.5 0.8 Unit V V V V V ms V V V V MHz MHz
22
Data Sheet S13918EJ3V0DS
PD72012
Recommended Oscillator Circuit Constants Crystal oscillator (TA = 0 to +70C)
Manufacturer Product name Frequency (MHz) Oscillator circuit constant (pF) C1 DAISHINKU CORP. AT-49 HC-49/U 4.000 4.000 10 9 C2 10 9
X1
X2
C1
C2
Cautions 1. The oscillator circuit constants, which show the conditions for stabilizing and oscillating, do not guarantee oscillation frequency accuracy. If the mounting circuit requires oscillation frequency accuracy, it must be possible to adjust the oscillation frequency of the oscillator in the mounting circuit. Therefore, ask the manufacturer of the oscillator you use about this directly. 2. When using an oscillator circuit, wire portions shown using broken lines in the figure as follows to avoid affecting wire capacitance. * Keep the wiring length as short as possible. * Do not cross the wiring with the other signal lines. * Do not route the wring near a signal line through which a high fluctuating current flows. * Always keep the ground point of the oscillator capacitor to the same potential as VSS. * Do not ground the capacitor to a ground pattern in which a high current flows. * Do not fetch signals from the oscillator.
Data Sheet S13918EJ3V0DS
23
PD72012
DC Characteristics (VDD = 3.3 V +0.3 V, TA = 0 to +70C) (1) Current consumption
Parameter Current consumption Current consumption (during suspend) Symbol IDD IDD(SUS) Conditions fCK = 48 MHz, 4 MHz MIN. TYP. MAX. 40 120 Unit mA
A
(2) USB input/output buffer
Parameter High level output voltage Low level output voltage Differential common mode range Symbol VOH VOL VCM Conditions 14.2 k RH for GND 1.42 k RL for 3.6 V Includes VDI range Absolute value of (D+) - (D-) 0.2 Vmin 0 V < VIN < 3.3 V MIN. 2.8 0 0.8 TYP. MAX. 3.6 0.3 2.5 Unit V V V
Data line leakage current in input pin high impedance state Crossover output voltage
ILO
10
A
VCRS
1.3
2.0
V
(3) 5 V output buffer
Parameter High level output voltage Low level output voltage Symbol VOH VOL IOH = -6 mA IOH = 6 mA Conditions MIN. TYP. MAX. 2.4 0.4 Unit V V
(4) Open drain output buffer
Parameter Low level output voltage Symbol VOL IOL = 6 mA Conditions MIN. TYP. MAX. 0.4 Unit V
24
Data Sheet S13918EJ3V0DS
PD72012
AC Characteristics (VDD = 3.3 V +0.3 V, TA = 0 to +70C) (1) Full-speed output driver characteristics
Parameter Output rise time (FS) Output fall time (FS) Symbol tFR, tFF Conditions UD0, UD1 CL = 50 pF, TA = 25C, 10% to 90% Crossover output voltage Driver output resistance Full-speed data rate Differential driver jitter (FS) VCRS ZDRV tFDRATE tDJ1 tDJ2 Source jitter on SE0 transition from differential transition (FS) Receiver jitter (FS) tFDEOP 12Mbps 0.25% Continuous transition Pair transition -2 1.3 28 11.97 2.0 44 12.03 3.5 4.0 +5 18.5 9 26 160 Accept as effective EOP. 82 14 175 V Mbps ns ns ns MIN. 4 TYP. MAX. 20 Unit ns
tJR1 tJR2
Continuous transition Pair transition
ns ns ns ns ns ns
One-way propagation delay EOP source SE0 interval EOP receiver SE0 interval SE0 time interval on differential transition
tFPROP tFEOPT tFEOPR tFST
(2) HUB repeater characteristics (Full-speed)
Parameter Output rise time (LS) Output fall time (LS) Symbol tr, tf Conditions D10 to D50, D11 to D51 CL = 50 pF, TA = 25C, 10% to 90% Differential data delay (LS) tHDD1 tHDD2 Differential driver jitter (LS) tHDJ1 tHDJ2 Data bit length distortion after SOP (LS) HUB EOP delay for tHDD1 EOP output width skew (LS) tFSOP With cable Without cable Continuous transition Pair transition 70 44 3 1 +5 ns ns ns ns ns MIN. 4 TYP. MAX. 20 Unit ns
tFEOPD tFHESK
0
15 15
ns ns
Data Sheet S13918EJ3V0DS
25
PD72012
(3) HUB event timing
Parameter Time to detect downstream port connection event (wake-up HUB) Time to detect downstream port connection event (suspend HUB) Time to detect disconnect event at downstream port (wake-up HUB) Time to detect disconnect event at downstream port (suspend HUB) Period to drive resume at downstream port (from control HUB only) Time from detecting downstream resume to re-broadcasting Time to detect long K state from upstream Time to detect long SE0 from upstream Period to repeat SE0 upstream tDRSMDN tDDIS Symbol tDCNN Conditions MIN. 2.5 TYP. MAX. 2000 Unit
s s s s
2.5
12000
2
2.5
2
10000.0
20
ms
tURSM
100
s s s
FS Bit time FS Bit time
tURLK
2.5
5.5
tURLSE0 tURPSE0
2.5
10000 23
Period to transmit SE0 upstream after EOF1
tUDEOP
Optional
2
26
Data Sheet S13918EJ3V0DS
PD72012
(4) Device event timing
Parameter Time from internal power becoming effective until device pulls D+/D- above VIHZ (MIN.) (signal attach) Time for USB system software to perform debounce after attach Time for which bus is continuously in idling state, maximum time device draws more power than suspend power Maximum value of average suspend time Period to drive upstream on resume Resume restore period Symbol tSIGATT Conditions MIN. TYP. MAX. 100 Unit ms
tATTDB
100
ms
t2SUSP
10
ms
tSUSAVGI
1
s
tDRSMUP tRSMRCY Supplied by USB system software Same as tURLSE0
1 10
15
ms ms
Time to detect reset from upstream Reset restore time Inter-packet delay Inter-packet delay of device responses using detachable cable Inter-packet delay of device responses using captive cable SetAddress() completion time Time to complete standard request without data stage Time to deliver first and subsequent data (excluding last) for standard request Time to deliver last data for standard request
tDETRST tRSTRCY tIPD tPDRSP1
2.5
10000 10
s
ms Bit time
2 6.5
Bit time
tPDRSP2
7.5
Bit time
tDSETADDR tDRQCMPLTND
50 50
ms ms
tDRETDATA1
500
ms
tDRETDATAN
50
ms
Data Sheet S13918EJ3V0DS
27
PD72012
Measurement Conditions (1) Differential data jitter
tPERIOD Crossover points
Differential data lines
Continuous transition N x tPERIOD + txJR1 Pair transition N x tPERIOD + txDJ2
(2) EOP transition skew and EOP length differential
tPERIOD Crossover point Differential data lines Extension crossover points
From differential data until SE0 skew N x tPERIOD + tDEOP
Source EOP width: tFEOPT, tLEOPT Receiver EOP width: tFEOPR, tLEOPR
(3) Permissible range of receiver jitter
tPERIOD
Differential data lines
tJR
tJR1
tJR2
Continuous transition N x tPERIOD + tJR1 Pair transition N x tPERIOD + tJR2
Remark
tPERIOD is the data rate of a receiver that has the range that is defined in paragraph 7.1.11 of USB Specification Revision 1.1.
28
Data Sheet S13918EJ3V0DS
PD72012
(4) HUB differential delay, differential jitter, and SOP distortion
(a) Downstream HUB delay including cable (b) Downstream HUB delay excluding cable
Upstream end of cable VSS Downstream end of HUB VSS
Upstream port of HUB 50% point of initial swing VSS Downstream port of HUB VSS
Crossover point
HUB delay downstream tHDD1
HUB delay downstream tHDD2
50% point of initial swing
(c) Upstream HUB delay with and without cable
Downstream port of HUB VSS Upstream port or end of cable VSS
Crossover point
HUB delay upstream tHDD1, tHDD2
Crossover point
HUB operation jitter: tHDJ1 = tHDDx(J) - tHDDx(K) or tHDDx(K) - tHDDx(J) Continuous transition tHDJ2 = tHDDx(J) - tHDDx(J) or tHDDx(K) - tHDDx(K) Pair transition Bit after SOP width distortion (same as data jitter of next transition of SOP): tFSOP = tHDDx(next J) - tHDDx(SOP) The low-speed timing below is determined by the same method. tLHDD, tLDHJ1, tLDJH2, tLUHJ1, tLUJH2, and tLSOP
Data Sheet S13918EJ3V0DS
29
PD72012
(5) HUB EOP delay and EOP skew
(a) Downstream EOP delay including cable 50% point of initial swing Upstream end of cable VSS tEOPUpstream port of HUB VSS tEOP+ Downstream end of HUB VSS tEOPtEOP+ Expansion crossover points (b) Downstream EOP delay excluding cable
Downstream port of HUB VSS
(c) Downstream EOP delay with and without cable
Downstream port VSS tEOPUpstream port or end of cable VSS
Expansion crossover points
tEOP+ Expansion crossover points
EOP delay: tEOPD = tEOPy - tEHDDx (tEOPy means apply this expression to tEOP- and tEOP+.) EOP skew: tHESK = tEOP+ - tEOP- The low speed timing below is determined by the same method. tLEOPD, tLHESK
30
Data Sheet S13918EJ3V0DS
PD72012
CS Timing Chart
500 sec 500 sec 500 sec 500 sec
HUB power supply Up port D+ line
BUS reset
PP pin output
Output cut-off
CS pin input Port power supply ON CS pin operation region
DEVICE connection inrush current
Overcurrent generation
Power supply ON Bus power: Up port connection Self-power: Power supply ON
CS detection delay time
CS active period
Remark
The active period of the CS pin is in effect only when the PP pin is ON. There is a delay time of approximately 500 sec duration at the CS pin.
Data Sheet S13918EJ3V0DS
31
PD72012
4. PACKAGE DRAWINGS
42-PIN PLASTIC SDIP (15.24mm(600))
42 22
1 A
21
K J I L
F M D H G
NOTES
1. Each lead centerline is located within 0.17 mm of its true position (T.P.) at maximum material condition. 2. Item "K" to center of leads when formed parallel.
ITEM A B C D F G H I J K L M N R MILLIMETERS 39.13 MAX. 1.78 MAX. 1.778 (T.P.) 0.500.10 0.9 MIN. 3.20.3 0.51 MIN. 4.31 MAX. 5.08 MAX. 15.24 (T.P.) 13.2 0.25 +0.10 -0.05 0.17 015 P42C-70-600A-2
R
N
M
C
B
32
Data Sheet S13918EJ3V0DS
PD72012
44-PIN PLASTIC QFP (10x10)
A B
33 34
23 22
detail of lead end S C D
Q
44 1 12 11
R
F G H P I
M
J
K M N S L S
NOTE Each lead centerline is located within 0.15 mm of its true position (T.P.) at maximum material condition.
ITEM A B C D F G H I J K L M N P Q R S
MILLIMETERS 13.60.4 10.00.2 10.00.2 13.60.4 1.0 1.0 0.35 +0.08 -0.07 0.15 0.8 (T.P.) 1.80.2 0.80.2 0.17 +0.08 -0.07 0.10 2.70.1 0.10.1 55 3.0 MAX. P44GB-80-3B4-5
Data Sheet S13918EJ3V0DS
33
PD72012
5. RECOMMENDED SOLDERING CONDITIONS
The PD72012 should be soldered and mounted under the following recommended conditions. For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology Manual (C10535E). For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Surface mount type soldering conditions
PD72012GB-XXX-3B4: 44-pin plastic QFP (10 x 10)
Soldering Method Soldering Conditions Recommended Condition Code IR35-00-3
Infrared reflow
Peak package temperature: 235C, Time: 30 sec. max. (210C min.), Count: three times or less
VPS
Peak package temperature: 215C, Time: 40 sec. max. (200C min.), Count: three times or less
VP15-00-3
Wave soldering
Solder bath temperature: 260C max., Time: 10 sec. max., Count: once, Preheating temperature: 120C max. (package surface temperature)
WS60-00-1
Pin partial heating
Pin temperature: 300C max., Time: 3 sec. max. (per device side)
-
Caution Avoid using different soldering methods together. (However, the pin partial heating method is excluded.) Through-hole type soldering conditions
PD72012CU-XXX: 42-pin plastic SDIP (15.24 mm (600))
Soldering Method Wave soldering (pins only) Pin partial heating Soldering Conditions Solder bath temperature: 260C max., Time: 10 sec. max.
Pin temperature: 300C max., Time: 3 sec. max. (per pin)
Caution Apply wave soldering only to the pins, and exercise care that solder does not directly contact the package.
34
Data Sheet S13918EJ3V0DS
PD72012
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function.
Data Sheet S13918EJ3V0DS
35
PD72012
The export of this product from Japan is prohibited without governmental license. To export or re-export this product from a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales representative.
* The information in this document is current as of April, 2001. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
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